TDK has an impressive track record in materials technology, in particular with regard to the development of ferrite and dielectric materials, and in process technology which is vital for bringing electronic components from the lab to the product stage. EPCOS on the other hand excels in radio frequency (RF) and module technology, and applications expertise, all of which are vital for developing electronic components for a broad spectrum of applications.
By putting the strengths of these two companies to optimum use, TDK-EPC Corporation is able to develop materials for a comprehensive range of electronic components, modules and systems, device manufacturing processes on the micron level, and create the functions and shape design that are needed to make advanced end products a reality. To name only two concrete examples, TDK has accumulated outstanding expertise in thin-film forming techniques for HDD magnetic heads. This can be applied to further refine the range of Surface Acoustic Wave (SAW) components and systems from EPCOS. Conversely, the Micro Electro Mechanical Systems (MEMS) technology of EPCOS is highly suited for TDK’s development of electronic components.
We aim to develop ever smaller electronic components, modules and systems with improved performance and better electrical parameters, which, for example, can be used under especially demanding environmental conditions at high temperatures or in aggressive media. To realize these solutions we rely on our expertise in materials and process technology, evaluation and simulation, circuit and applications as well as packaging technology. Only this makes it possible to create truly innovative products. Customers demand high performance, further miniaturization and increasing energy efficiency, and we are ideally positioned to rise to the challenges of the marketplace.