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Press Releases
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August 19, 2010 | Inductors: Sample kit with current-compensated ring core power chokes  | TDK-EPC, a group company of the TDK Corporation, presents a new sample kit of EPCOS current-compensated ring core power chokes. These EMC components are designed for a voltage of 250 V AC and offer current capabilities of between 0.4 and 6.0 A. Their inductances are between 0.2 and 39 mH. more |
July 22, 2010 | Inductors: Standard series of transformers for DSL splitters  | TDK-EPC, a group company of the TDK Corporation, presents a new standard series of splitter transformers from EPCOS for DSL applications. The series comprises 8 inductance values ranging from 1 to 10 mH. more |
July 8, 2010 | Power factor correction: Extended PhaseCap Compact series  | TDK-EPC, a group company of the TDK Corporation, has extended its range of power factor correction (PFC) capacitors. The EPCOS PhaseCap® Compact series now also comprises types for voltages from 415 V AC, 440 V AC, 480 V AC and 525 V AC. As an alternative to capacitors with dimensions of 136 mm x 200 mm (D x H), types with dimensions of only 116 mm x 224 mm or 116 mm x 248 mm are now also available, depending on the reactive power that must be compensated. more |
May 12, 2010 | Pressure sensors: Smallest differential pressure transmitter worldwide with an extended range  | TDK-EPC, a group company of the TDK Corporation, presents the EPCOS MiniCell™ series of pressure sensor transmitters, now with an extended range. Now these smallest media-separated differential pressure transmitters worldwide are available for unsymmetrical measurement ranges from 0 to 500 hPa and 0 to 2500 hPa. In addition, variants are offered for symmetrical measurements from -500 to +500 hPa and -2500 to +2500 hPa. more |
April 22, 2010 | Noise suppressing sheets: Flexield sheets improve performance of RFID tags | TDK-EPC, a group company of the TDK Corporation, has introduced a new TDK Flexield family of flexible RFID magnetic polymer sheets that can be shaped to the precise specifications set by manufacturers of RFID stickers and other emerging RFID device types. Flexield is a soft sheet that is created by depositing a magnetic powder on a polymeric resin base layer. Both flexible and shock-resistant, it is a highly effective noise suppressant when attached to RFID tags and stickers as well as other RFID devices operating at the 13.56 MHz frequency. more |
April 8, 2010 | Inductors: Thin-film common mode filter with integrated ESD suppression | TDK-EPC, a group company of the TDK Corporation, introduces the world’s first thin-film common mode filter (TCE1210) with both high-speed differential transmission common mode noise suppression and ESD protection in a single component. Mass production is scheduled to begin in April 2010. more |
April 6, 2010 | Power factor correction: Portable measuring equipment for grid analysis  | TDK-EPC, a group company of the TDK Corporation, presents a complete measurement system from EPCOS for the measurement and storage of electrical parameters in 3-phase low voltage grids. The MC7000-3 is designed for measuring voltages in the ranges from 3 x 30 V AC to 440 V AC (L-N) and 3 x 50 V AC to 690 V AC (L-L) at 50 Hz or 60 Hz. Currents of up to 3000 A can be recorded with the aid of a clamp-on ammeter. more |
April 1, 2010 | Inductors: Multilayer ceramic coils with high Q factor in 0402 | TDK-EPC, a group company of the TDK Corporation, announces the development of the MLG0402Q series of TDK multilayer ceramic coils in 0402 with a Q factor of 15.8 at 1 GHz and 10 nH. This is the world’s best and 40 percent higher than existing products. Mass production is scheduled to start in April 2010. more |
March 18, 2010 | Power capacitors: Compact DC-link circuit PCCs for electromobility  | TDK-EPC, a Group Company of TDK Corporation, presents the new PCC™ (Power Capacitor Chip) from EPCOS as an ideal DC-link circuit solution for the electric drives of motor vehicles. The B25655J4307K*1 and B25655J4507K*5 types were developed specifically for reference designs of the IGBT modules HybridPACK™1 (up to 20 kW) and Hybrid-PACK™2 (up to 90 kW) from Infineon Technologies. more |
March 11, 2010 | Inductors: SMD pulse transformers for LAN applications | TDK-EPC, a group company of TDK Corporation, has developed a series of TDK pulse transformers in SMD design for LAN use. The new product enables customers to employ automated placement of all components on the circuit board and using reflow solder and thus simplify their manufacturing processes. With an inductance of at least 200 μH and an insertion loss of not more than 1.5 dB, the new ALT4532-001T series of pulse transformers features the similar electrical properties as its predecessor product. Mass production began in February 2010. more |
March 4, 2010 | Acoustic components: World’s smallest MEMS microphones with a digital interface  | TDK-EPC, a group company of TDK Corporation, presents the smallest commercially available MEMS microphone worldwide with an integrated digital interface. The dimensions of the EPCOS T4030 of only 3.25 × 2.25 × 1.1 mm³ make the microphone about 60 percent smaller than alternative products. more |
February 25, 2010 | Multilayer ceramic capacitors: Further miniaturized series of C0G MLCCs | - 60 percent smaller than previous TDK components
TDK-EPC Corporation, a group company of TDK Corporation, presents a new series of multilayer ceramic capacitors (MLCC) with C0G temperature characteristics and a rated voltage of 50 V. Mass production began in December, 2009. The new series of TDK MLCCs are 60 percent or one size smaller than existing products with the same capacitance. With three times the capacitance of existing TDK MLCCs, the new products will have the world’s highest capacitance in the 50 V rated voltage range for C0G. more |
January 28, 2010 | PTC thermistors: SMD series with AEC Q-200 qualification  | TDK-EPC, a group company of the TDK Corporation, presents the new Superior series of EPCOS SMD PTC thermistors for limit temperature measurement. They are available in case sizes 0805, 0603 and 0402. Compared to the standard series, these components employ a more homogenous ceramic material. more |
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