Design, develop and implement new packaging techniques and processes for wafer fabrication and/or packaging and testing for the manufacture of SAW devices
Perform activities for the development, characterization, and implementation of new processes and materials into production
Develop new techniques for manufacturing, assembly and test, using experimental design, statistical method and material analysis techniques, validating new processes, evaluate failure data to find root cause and implement sound engineering solution
Review processing and testing techniques and methods, modify and improve processes
Conduct experiments and compile and evaluate test data to determine appropriate limits and variables for processes and material specifications and determine process capabilities.
Review product requirements to ensure compatibility with processing and testing methods with design goals, together with R&D and product designers
Develop programs to improve process yields and manufacturing efficiency
Recommend and prepare changes, additions, and modifications which will optimize processes, enhance yields, reduce costs and improve the manufacture of product/processes
Ensure compliance with all relevant internal procedures and policies, and quality system
Be a technical lead in a diverse team environment that includes interactions with R&D, suppliers, internal and external customers and production personnel
Education requirements
Degree in Mechanical Engineering or Physics
Requirements
Minimum 3 years’ related experience in a high volume manufacturing environment preferably in connection with intercontinental process transfers. Experience in flip-chip-bonding is an added advantage.
Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factory analysis
Have strong leadership qualities and be able to drive project teams in ensuring set time lines, costs and quality expectations are met
