Lead an engineering team in providing engineering support and technical know-how to Wafer or Pre-Assembly Production; in evaluating and modification of equipment / tools to improve equipment effiiciency, productivity and utilization
Coach the engineering team for effective monitoring and improvement of yield, process capability and efficiency using suitable tools
Lead and/or participate in package development projects and initiate engineering evaluations for new process and equipment qualification
Education requirements
Degree in any Engineering discipline, preferably in Chemical / Mechanical / Electronics / Electrical / Materials Engineering
Requirements
Minimum of 2 years related experience working in a high-volume manufacturing environment, preferably in Semiconductor wafer processing with knowledge of Photolithography, Wafer Bumping, Wet Benches or Process Gas Management (CVD / PECVD)
Knowledge of SPC tools, DOE, FMEA, GR&R, sampling plans, etc
Be dynamic, resourceful and self-motivated; and have strong communication and interpersonal skills
