Provide engineering support and technical know-how to assembly production; lead/ support quality and productivity improvement and cost reduction projects; lead selection, evaluation and qualification efforts of new packaging materials and processes for risk management and cost reduction objectives.
Maintain, modify and improve production equipment and tools so as to improve machine uptime, efficiencies and productivity; plan, organise and coordinate the installation and buy-off of new equipment; work closely with materials and equipment vendors in identifying and resolving technical issues; support in investigation of customer returns and implementation of corrective and preventive measures.
Education requirements
Degree in materials/ mechanical/ mechatronics engineering
Requirements
Experience working in a high volume manufacturing environment, preferably in semiconductor assembly manufacturing
Experience in FCB, PVD (sputtering), and dicing is an added advantage
Knowledge of SPC tools, DOE, FMEA, GR&R, sampling plans, etc.
Good analytical mind and able to organize works to identify the root cause of problems
Can work well under pressure
Be dynamic, resourceful and self-motivated
Possess strong communication and interpersonal skills
