• Responsible for designing, developing and implementing new packaging techniques and processes for wafer fabrication and/ or packaging and testing for the manufacture of SAW devices

• Perform activities for the development, characterization, and implementation of new processes and materials into production; develop implementation plans for new processes and equipment; and define processes and equipment requirements and specifications used in the manufacture, fabrication and evaluation of SAW devices

• Develop new techniques for manufacturing, assembly and test, using experimental design, statistical method and material analysis techniques, validating new processes, evaluate failure data to find root cause and implement sound engineering solution;  review processing and testing techniques and methods, modify and improve processes; and conduct experiments and compile and evaluate test data to determine appropriate limits and variables for processes and material specifications and determine process capabilities
• Review product requirements - together with R&D and product designers - to ensure compatibility with processing and testing methods with design goals
• Develop programs to improve process yields and manufacturing efficiency; recommend and prepare changes, additions, and modifications which will optimise processes, enhance yields, reduce costs and improve the manufacture of product/processes; and ensure compliance with all relevant internal procedures and policies, and quality system
• Be a technical lead in a diverse team environment that includes interactions with R&D, suppliers, internal and external customers and production personnel

Degree in mechanical engineering or physics

• Position 1: Minimum 3 years related working experience in a high volume manufacturing environment, preferably in connection with intercontinental process transfers.  Experience in flip-chip-bonding is an added advantage.

• Position 2: Minimum 3 years related working experience in a high volume manufacturing environment, preferably in connection with dicing and grinding processes.  Experience in laser technology or flip-chip-bonding is advantageous.

• Have strong leadership qualities and be able to drive project teams in ensuring set time lines, costs and quality expectations are met

• Possess experience in project management

• Familiar with Design of Experiments (DOE) methodology and Statistical Process Control (SPC)

• Possess good statistics and computer modeling knowledge

• Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factory analysis

• Ability to define problems, collect data, establish facts, and draw valid conclusions. Ability to interpret an extensive variety of technical instructions in mathematical or diagram form and deal with several abstract and concrete variables
• Ability to work under pressure and, if required, at irregular working times
• Excellent written and verbal communication skills with the ability to present and influence to a wide range of internal and external customers
• Be dynamic, resourceful and self-motivated
• Ability to speak German is an advantage