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Products

Inductors

SMT version with highest reliability

TDK Corporation presents a new series of EPCOS SMT inductors with the highest reliability. The components of the new R series offer 30 percent higher saturation current capability than standard series types. The saturation current is between 1.05 and 38.0 A at inductance values from 0.82 to 1000 µH.

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Photo: Istockphoto

LC resonators for position measurement

Length and position measurement in harsh environments

Conventional methods for measuring angles are only partially suitable for use in harsh environments. A new LC resonator from EPCOS has been designed especially for the accurate measurement under adverse conditions.

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RF components in DSSP technology

A new dimension in miniaturization

With innovative die-sized SAW packaging technology DSSP® from EPCOS, TDK drives miniaturization of RF filters and duplexers. These components are up to 85 percent smaller than the first generation CSSP® products.

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Film capacitors

Compact AC capacitors up to 75 μF

TDK-EPC, a group company of the TDK Corporation, presents a new series of EPCOS MKP AC capacitors with a capacitance range from 2 to 75 μF and radial terminals for PCB mounting. The B3279* series of output filter capacitors features types for voltages up to 400 V AC and can be used in a wide range of output filter modules.

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Applications

 

Multilayer ferrite coils for decoupling circuits

High current capability in a small package

Multilayer ferrite coils from the TDK MLZ-H series offer the high current capability required in the decoupling circuits of electronic devices such as digital cameras, video cameras and notebook PCs.

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Solutions for on-board chargers

All charged up

EPCOS and TDK components perform key functions in the Finepower’s on-board chargers for electric vehicles. They include inductors, transformers, capacitors and protective components.

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Photo: fotolia

NTC thermistors for power semiconductors

Integrated temperature protection

The new generation of EPCOS NTC thermistors is produced in a wafer-based manufacturing process – nearly eliminating fractures and assuring overtemperature protection of power semiconductors.

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