EPCOS – Electronic Components, Modules and Systems

Products

Power factor correction

Thyristor module for single-phase PFC

TDK Corporation has extended its range of EPCOS thyristor modules for dynamic PFC. The new TSM-LC-I module now also allows single-phase PFC of networks with rated voltages from 230 to 525 V AC.

LC resonators for position measurement

Length and position measurement in harsh environments

Conventional methods for measuring angles are only partially suitable for use in harsh environments. A new LC resonator from EPCOS has been designed especially for the accurate measurement under adverse conditions.

RF components in DSSP technology

A new dimension in miniaturization

With innovative die-sized SAW packaging technology DSSP^® from EPCOS, TDK drives miniaturization of RF filters and duplexers. These components are up to 85 percent smaller than the first generation CSSP^® products.

Film capacitors

Compact AC capacitors up to 75 μF

TDK-EPC, a group company of the TDK Corporation, presents a new series of EPCOS MKP AC capacitors with a capacitance range from 2 to 75 μF and radial terminals for PCB mounting. The B3279* series of output filter capacitors features types for voltages up to 400 V AC and can be used in a wide range of output filter modules.

Applications

High-voltage ceramic capacitors

Detecting voltage fluctuations in smart grids

Intelligent control systems help ensure the reliable and stable operation of power grids. Extremely low-tolerance TDK high-voltage ceramic capacitors are a key component in their automatic load break switches.

Varistors for photovoltaics

Effective protection of valuable solar installations

The reliable protection of valuable photovoltaic installations and their electronics against overvoltages and current surges is gaining in importance. TDK-EPC offers reliable solutions for this purpose.

NTC thermistors for power semiconductors

Integrated temperature protection

The new generation of EPCOS NTC thermistors is produced in a wafer-based manufacturing process – nearly eliminating fractures and assuring overtemperature protection of power semiconductors.