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Inductors

Rugged power inductors for automotive electronics applications

TDK Corporation has developed a new series of rugged power inductors for use in automotive electronics. The CLF6045NI-D wirewound SMD power inductors feature high efficiency and reliability over a wide temperature range from -55 °C to +150 °C and offer rated inductance values from 1.0 μH to 470 μH (E6 series).

December 2014
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Plant in Szombathely

Growth with automotive electronics

The plant in Hungary is celebrating its 20th anniversary. Since 1994, Szombathely has emerged as a highly competitive development and production center, especially for electronic components for automotive and industrial electronics applications. Now, the plant is set for further substantial expansion.

November 2014
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Multilayer diplexers for WLAN and Bluetooth in smartphones

Mini filters for multiband devices

Available space inside smartphones continues to shrink as they add more functions and serve more frequency bands. TDK has expanded its diplexer portfolio with the miniature DPX 1005 multilayer diplexer for WLAN and Bluetooth at 2.4 GHz and 5.0 GHz, which features power-saving low insertion losses with the smallest case size.

November 2014
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Reference design for space-saving ultrasonic distance measurement systems

Keep your distance!

ELMOS Semiconductor has developed a reference design for a compact ultrasonic parking assistant jointly with TDK. In addition to the ELMOS chipset, an EPCOS transformer of the EP6 series assures that the ultrasonic signal is matched to the impedance of the transducer.

November 2014
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SMD pulse transformer for LAN connectors

Space-saving, made-for-manufacture design

Compact TDK LAN pulse transformers enable pulse transformer modules small enough to fit in a standard RJ-45 LAN connector. The SMD components are designed for fully automated manufacturing processes and offer outstanding performance.

November 2014
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Plant in Gravataí

60 years of capacitors from Brazil

The plant in Gravataí, Brazil, has been producing capacitors for sixty years. During this period, the plant has developed state-of-the-art technologies for both aluminum electrolytic and film capacitors. As such, it is TDK’s only plant that manufactures both capacitor designs.

November 2014
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Bluetooth 4.0 low energy module

Benchmark for miniaturization

The Bluetooth Smart specification is designed to enable power-saving wireless connectivity for a growing range of wearable devices, sensors and other small mobile devices. The miniature TDK SESUB-PAN-T2541 Bluetooth 4.0 low energy module helps manufacturers of these devices get Smart.

November 2014
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EMC filters

LeaXield™ minimizes earth leakage currents

TDK Corporation presents the EPCOS LeaXield™ active filter module – a completely new solution for the minimization of earth leakage currents in power drive systems with frequency converters.

November 2014
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Capacitors

CeraLink™ – a compact solution for converters

TDK Corporation presents a new generation of the EPCOS CeraLink™, a highly compact solution for the snubber and DC links of fast-switching converters based on SiC and GaN semiconductors.

November 2014
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Inductors

Compact high-current chokes for 48-V automotive power systems

TDK Corporation presents the new BCEM series of EPCOS high-current chokes designed specifically for buck-boost converters in 48-V automotive power systems. These innovative SMD inductors have very compact dimensions of only 27.5 mm x 29.5 mm x 14.5 mm thanks to their ERU27 ferrite cores with flat windings.

November 2014
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Film capacitors

Snubber series with more terminal configurations and higher capacitance values

TDK Corporation has significantly extended its range of EPCOS snubber film capacitors: A total of 17 different terminal configurations are now available, enabling them to protect an even broader spectrum of IGBT modules against voltage peaks.

November 2014
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SAW components

Compact SAW duplexer with excellent isolation in the transmit and receive paths

TDK Corporation presents a new EPCOS duplexer for LTE Band 1, which at 60 dB features very high isolation for both the Tx and Rx paths. Based on SAW technology the B8651 duplexer has a miniature footprint of just 1.8 mm x 1.4 mm.

November 2014
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Design tools

New browser-based AlCap and FilmCap tools

Powerful design tools for EPCOS aluminum electrolytic and film capacitors now enable users to calculate the useful life for selected capacitor types under assumed operating conditions.

November 2014
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Power modules

Ultra-compact µDC-DC converters

TDK Corporation presents a new series of ultra-compact EPCOS µDC-DC converters. One 6-MHz power switch is embedded in the miniature PCB. The integrated power module saves up to 35 percent space compared with conventional discrete solutions.

November 2014
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CeraPlas™ piezo transformer and plasma generator

Cold plasma from a single component

Cold atmospheric pressure plasma promises decisive benefits in a wide range of industrial and healthcare applications. With the new EPCOS CeraPlas™, TDK offers a plasma generating component that is more compact, easier to integrate, and more efficient than conventional plasma generating technologies.

October 2014
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Inductors

SMT current sense transformers for automotive electronics

TDK Corporation presents two new EPCOS SMT current sense transformers for automotive electronics. The first type (B78417A2185A003) is based on an EP7 ferrite core and has dimensions of only 10.6 mm x 12.2 mm x 11 mm. The second SMT current sense transformer (B78419A2251A003) contains an EP10 ferrite core and measures 12.8 mm x 13.6 mm x 14.4 mm.

October 2014
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Multilayer ceramic chip capacitors

Portfolio of automotive-grade NP0 MLCCs expanded

TDK Corporation has expanded its CGA series of automotive-grade MLCCs based on NP0 ceramics and now offers the industry’s broadest portfolio of NP0 products in terms of voltage range and capacitance range.

October 2014
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Integration and miniaturization trends

Passive embedding

Thanks to new materials and integration technologies, the embedding and integration of passive components is making great advances. New miniaturized components designed specifically for embedding enable even more compact and reliable systems.

October 2014
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Aluminum electrolytic capacitors

Compact screw terminal series with high ripple current capability

TDK Corporation presents three new series of EPCOS aluminum electrolytic capacitors with screw terminals. They are characterized by their high ripple current capability and simultaneously highly compact dimensions.

October 2014
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Aluminum electrolytic capacitors

Compact snap-in series with significantly increased ripple current capability

TDK Corporation presents a new series of EPCOS snap-in aluminum electrolytic capacitors. They are characterized by a ripple current capability that is up to 25 percent higher than for the types of the preceding EPCOS series.

October 2014